Advanced packaging, which enables a new level of chippingfor a single application, equips any warehouse. These packages include
technologies such as System in Package (SiP), 3D/2.5Dchiplets, and streaming. In advanced packages, each offers multiple options for
integrating and assembling complex components or dies, giving chip customers a
variety of opportunities to differentiate the design and development of their
new ICs. . IC vendors are looking for IC packages with better electrical
performance and smaller size. SiP compared to 3D/2.5D is cheaper media and
requires more R&D. SiP is also less rigid than chiplets. A system package
combines multiple components into a single package, allowing the package to
function as a subsystem or electronic system. The customer can customize their
SiP by adding passives, arrays, MEMS, and antennas according to their needs.
SiP is used in various products such as smart watches, smartphones, car
systems, etc. These SiPs are widely used in WiFi modules, RF front end and
power supply ICs.
The most popular smartwatch in the market that has built-inSiP. By adopting System in Package technology, thecompany can develop more functions in its generation of smartwatch products
from generation to generation. A few other types of SiP are developing, such as
Heterogeneous System-in-Package (HSiP). The SiP developed by USI is very
different from that developed by OSAT manufacturers. At USI, our strengths in
SiP are in the area of product development for system applications. While our
OSAT partner, ASE, focuses on new chip-level technologies, USI offers customers
complete SiP solutions for miniaturized system modules, from detailed design to
module manufacturing.
Why use SiP in your products
Reduced size (XY) to have more space for battery and newfunctions
Reduce thickness (Z) and weight for an elegant ID design
Reduce the difficulty of Fatp
Improve integrity
EMI interference shield
Accelerate development
Better reliability - humidity and temperature
Faster and better inventory management
The current SiP has a long "running time". Today,ASSSiP USI tries to reduce or shorten lead times by creating standard SiP
products for specific projects or applications. For example, the performance of
the product can be demonstrated when some functional blocks can be connected
through SiP / SiM, which can significantly reduce and reduce the size of the
motherboard to make room for the battery, thus extending the life of the
battery .
