Compared to system integration on printed circuit boards,SIP maximizes system performance, eliminates re-packaging, shortens development
cycles, reduces costs, and increases integration. Compared with SoC, SIP also
has the characteristics of high flexibility, high integration, short design
cycle, low development cost, and easy access.
The SIP package integrates other components such as passivecomponents and antennas into a single package for a more complete system
function. From the point of view of application products, SiP technologies are more suitablefor low-cost, small-area, high-frequency and high-speed, and short-lived
electronic products, especially power amplifiers (PA), global positioning
systems, Bluetooth, portable product markets such as image sensing module and
memory cards. These characteristics also make these products highly applicable
to industrial applications, Internet of Things, mobile phones and smartwatches.
There are also very broad markets in the fields of smart bracelets and smart
glasses.
At present, when intelligent hardware manufacturers designsmart wearable devices, the main challenge is how to put all the required
functions into a very small space. Taking smart glasses as an example, in the
hardware design phase, it is necessary to consider the characteristics and
integration methods of main components such as wireless communication, an
application processor, storage memory, photographic lens, micro-projection
display, sensor, microphone, etc., while also evaluating component integration.
The use of the SIP system miniaturization design can simplify system design is
key for meeting their design criteria. It can increase the portability of the
product while adding a lot more functions without changing the appearance.
At present, the global output of packaging capacity alocatedto these types of packaging accounts for only 10% of the total value of
integrated circuits, but the emergence of SIP technologies are likely tobreak the current industrial structure of integrated circuits since changing
the package is only an issue at the subsequent processing plant. In the future
integrated circuit industry, there may be a group of entities that combine
design capabilities and packaging processes that maximize value of their
products and profits of their own brands. When the SIP technology is mastered
by a packaging company, the output value of the packaging industry has
significant potential moving forward
